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Global Mixed-mode Technology Inc.
G926
Dual 500mA LDO Regulator
Features
Wide Input Voltage Range: 4.3V~6.5V IO = 500mA, VOUT1 and VOUT2 Dropout Voltage Typically 1V Output Current in Excess of 500mA Output Voltage Accuracy 2% Quiescent Current, Typically 200A Internal Short Circuit Current Limit Internal Over Temperature Protection
General Description
The G926A is a dual low dropout regulator with VOUT1 2.5V/500mA and VOUT2 3.3V/500mA, G926B is with VOUT1 1.8V/500mA and VOUT2 3.3V/500mA, G926C is with VOUT1 3.3V/500mA and VOUT2 2.5V/ 500mA and G926D is with VOUT1 3.3V/500mA and VOUT2 1.8V/500mA. The dropout voltage is typically 1V with 500mA load. A low quiescent current is typical 200A. Familiar regulator features such as over temperature and current limit protection circuits are provided to prevent it from being damaged by abnormal operating conditions. The G926 comes in a SOP-8 and SOP-8 (FD) with power-pad package.
Applications
CD/DVD-ROM, CD/RW Wireless LAN Card/Keyboard/Mouse Battery-Powered Equipment XDSL Router
Ordering Information
ORDER NUMBER
G926AP1U G926BP1U G926CP1U G926DP1U G926AF1U G926BF1U G926CF1U G926DF1U
MARKING
G926A G926B G926C G926D G926A G926B G926C G926D
VOUT1
2.5V 1.8V 3.3V 3.3V 2.5V 1.8V 3.3V 3.3V
VOUT2
3.3V 3.3V 2.5V 1.8V 3.3V 3.3V 2.5V 1.8V
TEMP. RANGE
-40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C
PACKAGE (Pb free)
SOP-8 SOP-8 SOP-8 SOP-8 SOP-8 (FD) SOP-8 (FD) SOP-8 (FD) SOP-8 (FD)
Note: P1: SOP-8 F1: SOP-8 (FD) U: Tape & Reel
Pin Configuration
Typical Application Circuit
G926
VOUT1 1 VIN VIN VOUT2 2 3 4 8 7 6 5 GND GND GND GND VOUT1 1 VIN VIN VOUT2 2 3 4
G926
8 7 6 5 NC GND NC NC
VIN VIN VOUT1
VOUT1 10F
10F
G926
VOUT2 GND
VOUT2 10F
SOP-8
SOP-8 (FD)
Ver: 0.3 Preliminary Oct 19, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
1
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings (Note 1) Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Power Dissipation Internally Limited (Note2) Maximum Junction Temperature . . . . . . . . . . . .150C Storage Temperature Range . . . .-65C TJ +150C Reflow Temperature (soldering, 10sec) . . . . . . 260C Thermal Resistance Junction to Ambient SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .162C/W SOP-8(FD) . . . . . . . . . . . . . . . . . . . . . . . . . . .75C/W Thermal Resistance Junction to Case SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31C/W SOP-8(FD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .5C/W Electrical Characteristics
VIN =5V, IO = 500mA, CIN=1F, COUT =1F. All specifications apply for TA = TJ = 25C. [Note 3] PARAMETER
Input Voltage
G926
Operating Conditions
(Note 1) Input Voltage. . . . . . . . . . . . . . . . . . . . . . . .4.3V ~ 6.5V Temperature Range. . . . . . . . . . . . . .-40C TA 85C
SYMBOL
VIN G926A G926B G926C G926D G926A
CONDITION
MIN
4.3 2.450 1.764 3.234 3.234 3.234 3.234 2.450 1.764 ------------------550 550 -----
TYP
--2.5 1.8 3.3 3.3 3.3 3.3 2.5 1.8 0.3 0.5 200 53 53 53 1 650 650 800 800 150 25
MAX
6.5 2.550 1.836 3.366 3.366 3.366 3.366 2.550 1.836 1 1 500 ------1.2 -------------
UNIT
V
IO = 50mA 10mA < IO < 500mA 10mA < IO < 500mA IO = 50mA
Output Voltage1
VOUT1
V
Output Voltage 2
VOUT2
G926B G926C
V
Line Regulation Load Regulation Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current Current Limit Over Temperature Threshold Over Temperature Hysterisis
Vline Vload IQ PSRR VD Ishort Ilim TOT Thys
G926D 4V < VIN < 6.5V, IO = 10mA 10mA < IO < 500mA VIN = 5V fi=120Hz, VP-P = 1V, VO = 3.3V fi=120Hz, VP-P = 1V, VO = 2.5V fi=120Hz, VP-P = 1V, VO = 1.8V IO=500mA VOUT1 VOUT2 VOUT1 VOUT2
% % A dB
V mA mA C C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / JA. If this dissipation is exceeded, the die temperature will rise above 150C and IC will go into thermal shutdown. For the G926 in SOP-8 package, JA is 162C/W. For in SOP-8 (FD) with power-pad package, JA is 75C/W. Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum, aluminum or ceramic.
Ver: 0.3 Preliminary Oct 19, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
2
Global Mixed-mode Technology Inc.
Pin Description
PIN
SOP-8 1 2,3 4 SOP-8(FD) 1 2,3 4 5,6,8 7
G926
FUNCTION
NAME
VOUT1 VIN VOUT2 NC GND
I/O
O I O I I
VOUT1 output voltage 2.5V in G926A, 1.8V in G926B or 3.3V in G926C and G926D, and source up to 500mA. Input voltage VOUT2 output voltage 3.3V in G926A and G926B, 2.5V in G926C or 1.8V in G926D, and source up to 500mA. No Connection Ground also function as heat-sink.
5,6,7,8
Definitions
Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load.
Ver: 0.3 Preliminary Oct 19, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
3
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN=5V, CIN=1F, COUT =1F, TA=25C, unless otherwise noted.)
G926
Line Transient Response
Line Transient Response
Load Transient Response
Load Transient Response
Short Circuit Current
60
Ripple Rejection
IL=10mA 50 Ripply Rejection(dB) 40 IL=500mA 30 20 10 0 10 100 1000 Frequency (Hz) 10000 100000 CIN=10F; COUT =10F IL=100mA
Ver: 0.3 Preliminary Oct 19, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
4
Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Overcurrent Protection Characteristics
G926
Overcurrent Protection Characteristics
Start-up
Start-up
Output Voltage vs. VIN
1.809 1.807 Outpur Voltage (V) 1.805 1.803 1.801 1.799 1.797 1.795 2.5 3 3.5 4 4.5 V IN (V) 5 5.5 6 V O2 V O1 TA =25C ; IL=10mA 3.312 3.31 3.308 3.306 3.304 3.302 3.3 3.298 3.296 3.294 Output Voltage (V) 1.802 1.801 1.800 1.799 1.798 1.797 1.796 1.795 1.794 1.793 1.792 0 100
Output Voltage vs. IL
3.31 V IN=4.0V;V O1 3.30 V IN=5.0V;V O2 3.30 V IN=4.0V;V O2 V IN=3.3V;V O1 3.29
3.29
200 300 IL (mA)
400
3.28 500
Ver: 0.3 Preliminary Oct 19, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
5
Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Quiescent Current vs. VIN
250 1.0 0.9 Quiescent Current (A) 200 Dropout Voltage (V) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 2.5 3 3.5 4 4.5 VIN (V) 5 5.5 6 0.0 0 100 200 300 IL (mA) V O2 VO1 TA=25C
G926
Dropout Voltage vs. IL
150
100
50
TA=25C
400
500
Output Voltage vs. Temperature
3.324 1.809 1.807 Output Voltage (V) 1.805 1.803 1.801 1.799 1.797 1.795
-25 -15 -5 5 15 25 35 45 55 65 75 85
G926 Max. Power Dissipation vs. PCB Top Copper Area
2.5
Max. Dissipation Power (W) 3.314 3.304
2 1.5
VIN=5V;VO2 VIN=4V;VO1
3.294 3.284 3.274 3.264 3.254
1 0.5 0 0 1 2 3
2
IL=10mA
3.244 3.234 Temperature (C)
4
5
PCB Top Copper Area (in )
G926 Max. Power Dissipation vs. TAMB (still air)
2.5 SOP-8 Package Max. Dissipation Power (W) 2
Unit:in2
A=0.1 A=0.2 A=0.3 A=0.4 A=0.5
Recommended Minimum Footprint SOP-8/SOP-8 (FD)
1.5
A=1.0 A=1.5 A=2.0
1
A=2.5 A=3.0 A=3.5
0.5
A=4.0 A=4.5 A=5.0
0 25 35 45 55 65 TAMB (C) 75 85
Ver: 0.3 Preliminary Oct 19, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
6
Global Mixed-mode Technology Inc.
Package Information
C
G926
E
H
L D 7 (4X)
A2 A1 e B
A
y
SOP-8 Package
Note: 1. Package body sizes exclude mold flash and gate burrs 2. Dimension L is measured in gage plane 3. Tolerance 0.10mm unless otherwise specified 4. Controlling dimension is millimeter converted inch dimensions are not necessarily exact. 5. Followed from JEDEC MS-012
SYMBOL
A A1 A2 B C D E e H L y
MIN.
1.35 0.10 ----0.33 0.19 4.80 3.80 ----5.80 0.40 ----0
DIMENSION IN MM NOM.
1.60 ----1.45 ----------------1.27 -----------------
MAX.
1.75 0.25 ----0.51 0.25 5.00 4.00 ----6.20 1.27 0.10 8
MIN.
0.053 0.004 ----0.013 0.007 0.189 0.150 ----0.228 0.016 ----0
DIMENSION IN INCH NOM.
0.063 ----0.057 ----------------0.050 -----------------
MAX.
0.069 0.010 ----0.020 0.010 0.197 0.157 ----0.244 0.050 0.004 8
Ver: 0.3 Preliminary Oct 19, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
7
Global Mixed-mode Technology Inc.
D1
G926
0.008TYP
E1
E
H
L D 0.015x45
A2 0.004MAX. B A1 e
A
SEATING PLANE
SOP-8 (FD) Package
Note: 1. JEDEC Outline: MS-012 AA/E.P. Version: N/A 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed .15mm (.006in) per side. 3. Dimensions "E" does not include inter-lead flash, or protrusions inter-lead flash and protrusions shall not exceed .25mm (.010in) per side.
SYMBOL
A A1 A2 B D E e H L D1 E1
DIMENSION IN MM MIN
1.35 0.00 ----0.41TYP 4.80 3.81 1.27TYP 5.80 0.41 0 --------6.20 1.27 8 2.29 2.29 4.98 3.99
MAX
1.75 0.13 1.50
DIMENSION IN INCH MIN MAX
0.053 0.000 ----0.016TYP 0.189 0.150 0.05TYP 0.228 0.016 0 --------0.244 0.050 8 0.090 0.090 0.196 0.157 0.069 0.005 0.059
Taping Specification
PACKAGE
SOP-8 SOP-8 (FD)
Feed Direction Typical SOP Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
Q'TY/REEL
2,500 ea 2,500 ea
Ver: 0.3 Preliminary Oct 19, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
8

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